Minister of Informatics Ashwini Vaishnaw, Auto News, ET Auto

“The total budget allocation for activities / programs related to chip design during the current fiscal year is Rs 100 crore,” Vaishnaw said.

The government said on Friday it was aware of the importance of semiconductor design and had a budget allocation of Rs 100 crore for programs related to chip design during the year. current exercise. Electronics and IT Minister Ashwini Vaishnaw informed Rajya Sabha in a written response that semiconductor design is a knowledge-intensive field and requires manpower and tools. exceptionally qualified.

He said India has a huge talent pool for semiconductor design and a high number of design patents and intellectual property rights (IPRs) are produced in the country by engineers from design.

“The total budget allocation for activities / programs related to chip design during the current fiscal year is Rs 100 crore,” Vaishnaw said.

He said the government is focused on broadening and deepening the Electronic System Design and Manufacturing (ESDM) sector with semiconductor design as one of the focus areas.

Currently, manufacturing facilities for semiconductor wafers for strategic needs are available at the Semiconductor Laboratory (SCL), Mohali; Gallium Arsenide Enabling Technology Center (GAETEC), Hyderabad and Society for Integrated Circuit Technology and Applied Research (SITAR), Bengaluru, the minister said.

To drive the development of semiconductors, the government approved the “Establishment of Gallium Nitride (GaN) Ecosystem Enabling Center and Incubator for High Power and High Frequency Electronics”.

The project is implemented by the Society for Innovation and Development (SID) under the auspices of the Indian Institute of Science (IISc) at the Center for Nano Science and Engineering (CeNSE), Bengaluru at the full cost of the project of Rs 298.66 crore.

“An application for setting up the assembly, testing, marking and packaging (ATMP) of NAND flash memory has been approved under the Production Incentive Program (PLI) for the large-scale electronics manufacturing, ”Vaishnaw said.

He said that a demand for discrete semiconductor devices, including transistors, diodes, thyristors, etc. and the System in Package (SIP) has been approved under the PLI scheme for large-scale electronic component manufacturing.

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